1. UP Defence Industrial Corridor (UP DIC)
•Progress Aggregates (As of March 2026):
•Investment proposals attracted: ₹35,526.76 crore.
•Total industrial land acquired/procured: 2,040 hectares.
•Land allotted to defense manufacturers: 977.54 hectares.
•MoUs signed: 200 defense and aerospace enterprises with expected direct employment for 53,263 professionals.
•Lucknow Node: BrahMos Aerospace Next-Gen (BrahMos-NG) cruise missile manufacturing and testing facility.
•Jhansi Node: Bharat Dynamics Limited (BDL) propulsion and rocket motor manufacturing complex.
•Kanpur Node: Unmanned Aerial Vehicle (UAV) test range, high-grade defense ordnance, and ballistic protective equipment.
•Aligarh Node: Small arms, drone components, and precision mechanical assemblies.
•Incentive Architecture: Capital subsidy (25–35% up to ₹500–1,000 crore), logistics transport subsidy (up to ₹25 cr for exports), skill development grant (₹2 lakh/worker/yr up to 10,000 workers), and R&D Centre of Excellence grants up to ₹10 crore.
2. Electronics Component Manufacturing Policy 2025
•Capital subsidy up to 20% for units outside the central ECMS framework, plus top-up over central subsidies.
•Customized incentive packages for mega investments exceeding ₹2,000 crore.
•Special additions: +2% incentive for lithium-ion battery cells with local sourcing; +1% for multilayer printed circuit boards (PCBs) using local laminates.
•Land subsidy: 25% standard, rising to 50% in Bundelkhand and Purvanchal to direct electronic investments to backward regions.
3. UP Semiconductor Policy & Chip Ecosystem
•State Capital Subsidy: Provides an additional 50% capital subsidy over and above the Government of India's India Semiconductor Mission (ISM) subsidy.
•Land Subsidy: Offers 75% land rebate on the first 200 acres for qualified semiconductor wafer fabrication facilities.
•Exemptions: 100% stamp duty exemption and 100% electricity duty exemption for 10 years.
•Semiconductor Park: Being set up by YEIDA (Yamuna Expressway Authority) near Jewar Airport, hosting Foxconn-HCL display/OSAT joint venture and high-density chip packaging plants.
•Prelims Nuance: Distinguish between Wafer Fabrication (front-end nanometer manufacturing), OSAT / ATMP (Outsourced Semiconductor Assembly and Test), Component Manufacturing (resistors, diodes), and PCB Assembly.